- Stok Durumu: Stok Var
- Marka: OEM
- SKU: RBZ.101.329
8.8mm x 8.8mm x 5mm Aluminum Metal Heatsink Block
Radiator Amplifier Led Ic Transistor Vga Ram Memory Cpu Gpu Peltier Heat Reducer
The 8.8x8.8mm Aluminum Heatsink is a small passive heatsink with a flat 8.8mm x 8.8mm base, 5mm height and 5 fins. The black coated aluminum body is attached to the top surface of small package ICs; it carries the heat of the chip to the fins and spreads it into the air. It needs no fan, and with a weight of approximately 0.7gr it adds no load to the circuit.
It is mostly used on the A4988, DRV8825 and TMC2209 stepper motor driver chips of 3D printer and CNC boards, and on RAM and small regulator, MOSFET or amplifier ICs. The base of the heatsink is fixed to the chip with thermally conductive double sided tape or thermal adhesive. Cooling increases as air passes between the fins; efficiency is higher where the case has fan airflow.
Key features:
Fits stepper driver chips: The 8.8mm x 8.8mm base sits on the mounting surface (top of the chip or the cooling area of the module) of stepper motor driver modules such as A4988, DRV8825 and TMC2209; it is a heatsink size commonly used on stepper driver modules.
5 fin structure: 5 parallel fins increase the surface in contact with air relative to the small base and release the heat of the chip into the air faster.
Passive cooling: Needs no fan, power or cable; it is silent. Cooling increases further where there is fan airflow.
Light and low profile: With approximately 0.7gr and 5mm height it takes no room in narrow cases and on vertically mounted boards, and stays in place with tape.
Features:
- Product type: finned passive aluminum heatsink (radiator)
- Suitable parts: A4988, DRV8825, TMC2209 stepper driver chips, RAM, small regulator, MOSFET and amplifier ICs
- Cooling type: passive; needs no fan, efficiency increases with fan airflow
- Fin structure: 5 parallel fins
- Base: flat base, sits flat on the top surface of the chip
- Mounting: with thermally conductive double sided tape or thermal adhesive
- Construction: one piece body cut from extruded aluminum profile
- Surface: black coating
- Electrical conductivity: the aluminum body conducts electricity
- Where used: 3D printer and CNC boards, mini computer boards, power and audio circuits
- Operating temperature: -40°C - 120°C
- Material: aluminum
- Colour: black
- Base size: 8.8mm x 8.8mm
- Dimensions: 8.8mm x 8.8mm x 5mm
- Weight: approximately 0.7gr
Usage information:
- Clean the top surface of the chip with a dry cloth and alcohol; apply the thermal tape or thermal adhesive to the base of the heatsink and press the heatsink onto the center of the chip.
- On stepper driver modules place the heatsink so that the fins are parallel to the airflow direction of the fan in the case; the air passes between the fins.
- If the heatsink overhangs the chip, check that it does not touch the adjacent pins, the adjustment potentiometer or other parts.
Applications:
- Stepper driver modules (A4988, DRV8825, TMC2209)
- 3D printer and CNC control boards
- RAM and memory chips
- Processor and USB chips of mini computer boards
- Small package regulators and MOSFETs
- Led driver circuits
- Amplifier and audio ICs
- Router, modem and TV box chips
- Sensor and communication modules that heat up
Precautions:
- The aluminum body conducts electricity: if the heatsink touches adjacent pins, solder joints or exposed conductors it causes a short circuit.
- The heatsink is small and passive; it does not cool high power parts on its own. If the chip still gets very hot, reduce the driver current or add a fan.
- Do not place it on the chip without thermal tape or adhesive; the air gap blocks heat transfer and the heatsink may fall off.
- It is not suitable for TO-220 package transistors and regulators; use a screw mounted TO220 heatsink for them.
Package contents:
- 1 Piece 8.8x8.8mm Aluminum Heatsink
- Note: Thermal adhesive is not included in the package.